Design for Manufacturing in Electronics: 11 Practical Tips

May 2025
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16 min
Engineering
Startup
Hardware

11 practical DFM tips for electronics engineers — drawn from real hardware projects at EnCata.

If you're tackling PCB Design for Manufacturing (DFM) for the first time, it's essential to approach the process with a clear understanding of best practices and the factors that directly impact fabrication, assembly, and testing. Good DFM decisions reduce the risk of errors, delays, and unnecessary costs — helping your design make it to production more smoothly.

This guide is for hardware startup teams, product engineers, and anyone building a custom electronic device for the first time — especially if you’re moving from prototype to something that actually ships. 

At EnCata, we support startups and product teams applying design for manufacturing in electronics at every stage of development — from DFM reviews to full-cycle electronics design and prototyping. The tips below are drawn from our engineers’ hands-on work across dozens of real-world projects.

1. Understand Your Manufacturer's Capabilities and Constraints

This point applies to virtually every project, as it outlines a sound approach to PCB design and manufacturing—so please don’t be put off by its apparent obviousness.

  • Learn the Manufacturer's Specifications: Start by understanding the minimum trace width, spacing, and drill hole sizes your PCB manufacturer supports. Manufacturers often provide design guidelines, which are crucial for DFM.
  • Layer Stack-up: Make sure your design is compatible with the available layer stack-up options (e.g., 4-layer, 6-layer). Be mindful of blind/buried vias and via sizes based on the manufacturer’s capabilities.
  • Material Selection: Choose PCB materials that are suitable for your design's performance, cost, and manufacturability (e.g., FR4, RO4350B, etc.). Ensure the material is compatible with the manufacturer’s equipment and processes.

At the early stages, your focus should always be on the goal of this particular version of the product, not the final version you hope to launch down the line.

Q: What specs should I align with my PCB manufacturer during early-stage DFM?

To avoid costly revisions later, align your design with your manufacturer’s minimum trace width, spacing, drill sizes, and supported stack-ups. This section emphasizes tailoring your material and via choices (e.g., blind/buried vias, FR4 vs. RO4350B) to what your fab house actually supports.

PCBs showing consistent drill holes, trace widths, and controlled edge clearances for DFM alignment with manufacturer specs

2. Start with a Simple, Modular Design

Modular PCB design isn’t about cutting corners — it’s a practical way to save time. When parts of the design can be reused or easily swapped, prototypes and test units get built faster. That matters when you’re working on things like seasonal products, where delays can cost you the whole launch.

  • Start Simple When Possible: If you’re just getting started with DFM or working under tight time or cost constraints, consider starting with a relatively simple PCB. Avoid advanced techniques like high-speed routing or complex multi-layer designs unless the application clearly calls for them. This makes it easier to learn and iterate without being overwhelmed.
  • Modular Design (When Feasible): If your product type and size allow, consider breaking the PCB into modular blocks
    (e.g., power, analog, digital sections). This can simplify troubleshooting, upgrades, and future redesigns. However, keep in mind that not all products can benefit from modularity — it largely depends on factors like enclosure constraints, form factor, or system integration requirements.

The pictured device is a climate control unit developed by EnCata. Modularity was used here to standardize hardware modules across several versions of the device, saving significant time in both initial development and future upgrades. This approach makes it easier to implement updates or create version-specific modifications without redesigning the entire system.

Without modularity, even small adjustments — such as changing the interface logic or adding new sensors — would require reworking the full board layout, re-running simulations, and potentially going through another full prototyping cycle.

Modular PCB system with vertical daughterboards, used for faster prototyping and hardware reuse in EnCata’s climate control unit

3. Consider Component Placement Early

Сomponent placement is one of those decisions that’s hard to undo. It directly affects how easy (or painful) your PCB will be to assemble, test, and fit into an enclosure. Good layout choices made early on help avoid late-stage surprises — like mechanical clashes or last-minute board respins.

  • Component Clearance: Ensure that you provide enough clearance around components to accommodate the assembly process (e.g., pick-and-place). Follow the manufacturer’s component spacing guidelines to avoid mechanical interference during assembly.
  • Orientation and Access: Arrange components so that connectors and test points are easily accessible, and polarized components (e.g., diodes, electrolytic capacitors) are correctly oriented.
  • Minimize Component Count: A simpler design with fewer components will be easier to manufacture and assemble. Try to avoid unnecessary complexity.

In the project below — a compact heart sound monitoring device designed to capture and transmit cardiac acoustic signals to a smartphone for further analysis — careful component placement made all the difference. We were working with a small board (31 × 38 mm), so optimizing layout early helped us avoid mechanical clashes and a costly redesign.

We kept all components on a single side and placed the USB connector right at the edge to ensure proper fit within the enclosure. Instead of spreading out filtering across multiple discrete capacitors, we consolidated into fewer universal components where feasible — saving both board space and routing effort.

At first, we used components from U.S. suppliers, but after internal testing and validation, we transitioned to equivalent parts from Chinese manufacturers. That switch helped reduce overall BOM cost by 10–15%, which made a real impact given our strict cost ceiling.

Q: What makes component placement critical for manufacturability?

If we hadn’t thought through component layout from the start, we would’ve likely faced mechanical interference — especially around the USB connector and test pads. That would’ve meant rerouting traces, shifting components, and ordering a new round of PCBs just to fix spacing issues.

Compact 31×38 mm PCB for heart sound monitoring, showing optimized component placement on a single side

4. Focus on Trace Routing and Signal Integrity

This part might sound a bit too obvious — everyone knows that traces carry signals, right? But that’s exactly why it’s worth calling out. In real-world projects, it’s easy to get caught up in complex tasks and assume that things like signal integrity or trace layout will “just work.” The truth is, they won’t — and small mistakes here can quietly break your design, even if everything else looks fine. This section is a reminder of those core things that are easy to overlook but essential for a board to work reliably.

  • Trace Width and Spacing: Use appropriate trace width and spacing based on your signal types and your manufacturer’s capabilities. Most PCB design software will allow you to set up Design Rule Checks (DRC) to ensure you’re following the correct trace width/spacing guidelines.
  • Signal Routing: For high-speed designs, maintain controlled impedance for traces, minimize crosstalk, and ensure adequate return paths for signals. You may need to adjust routing for differential pairs, ground planes, or power planes.

The PCB shown here is from one of our designs where differential pairs were routed with strict impedance control (targeting 100 Ohms) and sub-millimeter trace length matching. This kind of layout is essential in designs involving RF or high-frequency digital interfaces.

Q: How do trace length and impedance matching prevent high-speed failures?

In this case, length-matching was critical: a skew of more than 500 mils could push timing beyond the 50 ps tolerance window. That’s why you see the characteristic serpentine "wiggles" in the layout — they compensate for physical length mismatches between paired traces, ensuring synchronous signal arrival.

We validated trace geometry against manufacturer specs and checked final routing through simulation and eye diagram testing. When done right, this eliminates signal reflections, reduces crosstalk, and ensures clean operation at speeds up to 3.2 Gbps.

Length-matching serpentine traces highlighted below help synchronize differential pairs. Without them, even a well-routed interface might fail at high speeds.

Serpentine traces on differential pairs — for matching length and keeping timing clean

5. Don’t Overengineer Your Vias

Via planning may seem like a small detail in PCB design — but it has a direct impact on both cost and manufacturability. It’s not about picking the most advanced technology available; it’s about choosing what’s appropriate for the board’s complexity and purpose.

  • Via Sizes: Vias are sometimes described as one of the more expensive features on a PCB. That’s only partially true — for standard designs using regular through-hole vias (typically 0.3–0.5 mm drill diameter), the cost impact is usually minimal, unless you have hundreds of them. Still, it's good practice to avoid overusing vias and stick to the smallest size your manufacturer supports (often 0.2 mm drill / 0.4 mm pad) to keep routing simple and the production process clean.
  • Via Types: Blind, buried, and microvias — these sound impressive, and they do serve a purpose. But they only make sense when you're dealing with boards that have very high component density or specific signal integrity needs (like RF or HDI designs). For most day-to-day projects, using these vias adds cost without real benefit. Justifying them usually requires a clear technical need — not just habit or curiosity.

In the VR glasses project, we used resin-filled vias to support clean and reliable BGA placement. In that case, the layout didn’t leave room for escape routing through standard vias without compromising solder joint quality. Resin-filled vias helped maintain consistent solder volume and reduced assembly defects — critical for the yield of a high-pin-count component.

Q: When are resin-filled or blind vias actually necessary?

However, this is an exception. In most of our work — IoT, consumer electronics, industrial devices — we rarely use blind or filled vias. Not because they’re “too expensive,” but because they’re simply not needed. The added complexity only makes sense when you're working with extremely dense layouts, fine-pitch BGAs, or miniaturized medical-grade hardware. Otherwise, standard vias are not just sufficient — they’re preferable.

Layered cross-section of a multi-layer PCB showing different via types, including through-hole, blind, buried, and resin-filled vias

6. Plan for Testing and Debugging

Testing and debugging aren’t just about making prototypes easier to work with — they’re critical for scaling your design into production. When you build testing features into your PCB from the start, you make life easier not only during early development, but also when the board hits the factory floor.

  • Test Points: Make sure key signals and power rails are accessible through test points. This isn’t just about convenience during prototyping — it also lays the groundwork for automated testing during mass production. In high-volume builds, manufacturers often run boards through test rigs that rely on predefined points. If you’ve placed them well, the testing process becomes faster, more consistent, and easier to automate — which improves yield and reduces waste.
  • JTAG or Boundary Scan: If your board includes complex components like microcontrollers, FPGAs, or processors, it's worth considering JTAG or boundary scan. While this adds some design effort — including coding test sequences and preparing scan chains — it pays off by enabling deeper, more precise defect detection after assembly. This can catch issues that visual inspection or simple functional testing might miss.

Q: How does designing for testability improve production outcomes?

Designing with testing in mind improves quality at scale. In production, well-defined test points and JTAG support allow automated systems to catch defects early — before boards go into enclosures or out to customers. Yes, adding JTAG may increase initial cost, but it gives you much better visibility into failures and lets you build trust into your product from the start.

Testing a prototype on the bench — multimeter, probes, and signal trace on screen

7. Design for Automated Assembly

If you’re planning to scale your PCB to even a small production run, designing with automated assembly in mind is a must. It’s what allows you to go from hand-built prototypes to factory-built units — quickly, reliably, and at a lower cost.

  • Solder Mask and Pad Design: Make sure your pad layouts are compatible with automated pick-and-place machines and reflow soldering processes. A good rule of thumb: if your layout causes problems during prototyping, it’ll cause bigger ones during mass production.
  • Minimize Manual Soldering: Avoid using components that require hand-soldering — like large connectors or parts that are hard to align. For example, barrel jacks, through-hole pin headers, or angled USB Type-B connectors often require manual positioning and soldering. When possible, stick to SMD components that can be placed and soldered automatically. This simplifies the whole assembly process and reduces the risk of human error.

In one of our projects, we deliberately prioritized surface-mount components and avoided connectors that require manual alignment. This wasn’t just for convenience — it was a design choice made early on to align with our automated production process. As a result, we were able to go straight to factory assembly with no redesigns or manual workarounds. Had we chosen otherwise, the project would have faced additional costs and delays due to hand soldering and post-assembly adjustments.

Q: What makes a PCB layout more compatible with factory assembly?

Favoring SMD components and avoiding awkward connectors (e.g., barrel jacks) lets your design move from bench to factory without manual workarounds. EnCata intentionally selects parts aligned with automated pick-and-place and reflow workflows.

PCB with SMD components and factory-aligned layout optimized for automated pick-and-place and reflow soldering

8. Use Design Rule Checks (DRC) and Electrical Rule Checks (ERC)

DRC and ERC are more than safety nets — they’re essential tools that guide how your PCB is built and verified. From the moment you start layout, these rules help ensure your design is both manufacturable and electrically sound.

  • Design Rule Checks (DRC): Design rules are set early, based on the manufacturing partner’s capabilities — like minimum trace width, spacing, or via sizes. Once those limits are in place, the design has to work within them. That’s why DRCs aren’t just a final check, but an ongoing validation as you build your layout. If you run into density challenges, you may need to revisit those rules — adjusting tolerances or negotiating tighter specs with your fab house.
  • Electrical Rule Checks (ERC): ERCs help catch logical mistakes in your circuit — like missing connections, unconnected power pins, or shorted nets. These kinds of errors can easily go unnoticed in layout and often lead to non-functioning prototypes. Running ERCs throughout the design phase helps you find them early, when they’re still cheap and easy to fix.

The highlighted layout section shows a case where a trace failed the DRC due to insufficient clearance to a neighboring signal. This kind of issue is typical in high-density boards, especially when pushing trace widths or spacing limits.

In projects with tight constraints — such as compact embedded systems or miniaturized wearables — we often hit these DRC violations during layout. Spotting them early helps us avoid more expensive fixes later on, like board re-spins or negotiating last-minute exceptions with the PCB manufacturer.

This process is standard in every project — not just for quality, but for feasibility. Defining the rules early helps prevent design loops and lets you work with clear, predictable constraints. In some high-density layouts, we’ve had to push the limits — reducing trace widths or clearances. When that happens, these checks help us quickly identify which parts of the layout need rework or renegotiation with the manufacturer. Without them, you’re flying blind.

Top: not enough clearance between trace and polygon — fails DRC. Bottom: clean and safe

9. Create Detailed Gerber Files and Bill of Materials (BOM)

No matter how solid your PCB design is, manufacturing doesn’t start until your files are in order. That means clear, industry-compliant Gerbers and a complete, reliable Bill of Materials. These are your product’s passport to production.

  • Gerber Files: Generate Gerber files define what the factory will physically build. Ensure all layers — copper, silkscreen, solder mask, drill — are included and follow standard formats like RS-274X. Consistent formatting and naming prevent delays and miscommunication with your manufacturer.
  • Bill of Materials (BOM): Your BOM should be complete, accurate, and structured. It should list every component with part numbers, values, tolerances, and manufacturers. Avoid hard-to-source or unreliable parts — that’s one of the fastest ways to slow down procurement and inflate costs.

In our experience, following best practices for documentation means the board gets produced faster, with fewer questions from the factory, and a much lower chance of build errors. When your BOM and Gerbers are clean, production flows — and if they’re not, everything stalls. Fortunately, we’ve never had to learn that the hard way. But if we had neglected these basics, we probably wouldn’t be writing this article.

Q: What details should a Gerber file and BOM include for a smooth production handoff?

Include all copper, silkscreen, solder mask, and drill layers with consistent naming. BOMs must be accurate and fully populated with sourcing data.

PCB design next to a BOM view — showing what manufacturers actually need to build your board without confusion

10. Review and Iterate

Before a design moves forward, it needs to be challenged. A thorough review — ideally by someone who hasn’t been staring at the board for weeks — can catch blind spots, challenge assumptions, and validate that the design is truly ready for manufacturing. It's not about finding errors just for the sake of it; it's about putting confidence behind every next step.

  • Peer Review: Ask a colleague or experienced engineer to look over your design. They may catch subtle issues with layout, signal flow, or component placement — or they might simply suggest a cleaner, more robust approach. This step is less about fixing and more about verifying.
  • Prototype Testing: Once reviewed, move to real-world testing. A physical prototype can reveal things simulation and schematic checks won’t — thermal performance, connector fit, or subtle EMI issues. If problems surface, then iteration becomes a targeted and strategic response — not a last-minute scramble.

Review is what helps you avoid surprises. And iteration — when needed — ensures those surprises don’t make it into production. It's a safeguard that serious products rely on. Imagine if the first iPhone’s antenna issue hadn’t been caught and reworked, or if early Tesla firmware hadn’t gone through repeated hardware-prototype cycles. The value wasn’t just in iteration — it was in having a process that caught what mattered, before it reached customers.

Test setup of a complex PCB with debug headers and heat sinks, used during review and prototype iteration to catch layout or thermal issues

Bonus Tips for First-Time DFM

When you're just starting with DFM, two things can give you a huge advantage: built-in design tools and early communication with your manufacturer. Neither takes much effort, but both can prevent delays, reduce costs, and improve quality — right from the start.

  • Use DFM Tools: If your PCB design software includes DFM checks or integrates with third-party tools (like Valor NPI or Zuken), make use of them. These tools help automate rule checks, identify manufacturability issues early, and streamline the handoff to production.
  • Work Closely with Your Manufacturer: Reach out to your PCB manufacturer early in the design phase. They can give you direct input on what’s manufacturable, which components are in short supply, and how to optimize your layout for their process. 

We use this approach in every project we do: automated checks, early manufacturer input, and smart tooling are simply how we work. It’s not an extra layer of quality — it’s how we ensure consistency, speed, and reliability across the board.

In closing,

Design for Manufacturing is about making practical choices early — ones that help your board get built without issues later. The earlier you think about things like layout, testability, and manufacturer constraints, the fewer problems you'll run into down the line.

At EnCata, we apply these principles in our daily work — from one-off prototypes to production-ready electronics. If you're unsure about your board's manufacturability, we can help take a look.

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