We help hardware teams avoid costly PCB redesigns and integration delays by developing electronics with the entire product system in mind from the start. EnCata covers the full cycle – from electronic architecture and integration through to prototyping
We approach our work through product sensing, power management, communication with other devices, data processing, and repeated manufacturing not as a checklist, but as a sequence of interdependent decisions.
We define the electronic architecture, key components, interfaces, power rails, and constraints before the PCB is routed.
We plan how the electronics will be powered up, flashed, measured, debugged, and tested before the board goes into production.
We check how the board powers the product, reads sensors, handles noise, communicates, and holds a signal through vibration, temperature swings, or a metal enclosure that blocks your antenna.
We prepare the files and updates needed for repeated PCB manufacturing and assembly: BOM, Gerbers, drilling scheme, assembly files, DFM/DFT notes, and production test requirements.
We serve as your dedicated engineering team, eliminating the hassle of coordinating with various freelancers or companies.
We engineered a fully working custom cold storage system for digital asset custody in just 3 months. If your project demands that same level of speed and reliability, we're ready to prove it on your timeline.
You know what you pay for. We break down what's behind every stage.
No matter where your team is based, we can deliver prototypes, firmware builds, test samples, and documentation without logistical hassle.
You get architecture, PCB layout, firmware, and prototyping under one roof, so a signal integrity issue doesn't bounce between three vendors before someone owns it.
Antenna placement, shielding, and enclosure geometry affect RF performance and CE/FCC outcomes. We account for that before layout, not after a failed test.
For 15 years, we have been refining our internal processes and expanding our technology stack to tackle more complex embedded systems. The list below is not exhaustive, and you can always specify what you need for your project in the contact form.
Deep domain understanding increases the success rate of your product.
A PCB layout can look complete while the product is still not ready to work as a real device. The actual engineering challenge lies in power behavior, signal quality, component choice, firmware interfaces, sensor accuracy, thermal limits, and manufacturing constraints. That is why we first define what the device must measure, control, power, transmit, protect, and withstand. Only then do we translate these requirements into architecture, schematics, PCB layout, testing procedures, and production files.
Power rails, grounding, protection, interfaces, and control logic define whether the device can operate reliably.
Analog readings, noise, EMI, ADC accuracy, RF paths, and sensor placement can change the final product performance.
Test points, programming connectors, logs, firmware hooks, and debug access reduce the time spent finding hardware issues.
Work that highlights the incredible technologies, solutions, and products EnCata developed
EnCata developed an 8K VR headset for sports training which featured ultra-high resolution, a wide field of view, and compact dimensions. It allowed real-time interaction between players in different places. The prototype was ready for pilot production in just 8 months.
display resolution
field of view
EnCata provided mechanical and electronics engineering services to design and prototype a modular waterproof enclosure (IP-67) for marine navigation.The system analyzes a vessel’s movement data and the hydrometeorological situation to improve navigational safety.
from idea to field testing
connectors & cables needed
EnCata developed a minimum viable product – a robot for factory and warehouse automation. It can carry loads of up to 200 kg, operate autonomously for 3 hours without recharging, and features a 120×80×40 cm platform.
load capacity
operating time under load
EnCata helped a startup develop a smart soil irrigation system from concept to MVP. The system includes custom electronics, BLE, LoRaWAN, and solar-powered modules for real-time soil monitoring and control. Built and tested in just 8 months.
range of operation
remotely through the mobile network and directly via Wi-Fi modules
EnCata developed a control cabinet that manages a heat chamber (60 °C heating, humidity, ventilation, safety) and integrates a cold chamber and chiller via RS-485 for one of its customers. The cabinet is part of a climate system designed for simulating extreme temperatures for firefighters.
total power of the heating circuit
upper temperature limit
EnCata developed a multifunctional IoT device that purifies, humidifies, ionizes, and monitors indoor air. We supported a consumer startup as an engineering contractor — from concept and embedded software to pilot production. All IP belongs to the customer.
successful crowdfunding campaigns
features delivered in one device, replacing multiple single-purpose products
.webp)
IIoT solution combining thermal metering, flow regulation, and smart valve control. Built from scratch (TRL 1) and deployed in real infrastructure (TRL 9). All IP belongs to the customer.
reduction in heat energy after installing the custom IIoT system
reduction in CAPEX reduction from replacing legacy heat metering infrastructure
Reach out, and we’ll show you how we take ideas – from consumer wearables to industrial test equipment – and turn them into pilot-ready devices.
From electrical architecture to pilot-ready hardware. Each stage answers a different product-readiness question.
Is the selected electronic architecture viable?
Does the system work on custom hardware?
Does the electronics remain stable as part of the product?
Can it move toward pilot production?
Through dozens of electronics projects, we’ve learned that a reliable board starts with well-defined requirements that shape the system architecture and every subsystem decision.
Power, sensing, control, connectivity, protection, UI, and test blocks each answer a specific product requirement. If we can't trace a circuit back to a requirement, it's a candidate for removal, not a feature.
A connector placed for mechanical convenience can break your antenna's ground plane. We settle module positions in layout (EVT is too late to re-route the return current path).
Power rails, RF paths, analog signals, high-current circuits, and critical interfaces get extra attention because they are the most expensive to fix after PCB manufacturing.
BOM, Gerbers, drilling files, assembly data, DFM/DFT notes, and component alternatives are prepared around manufacturer constraints, so the board can be built repeatedly.
Related engineering services that support electronics development and help turn a working PCBA into a complete hardware product.
Embedded software, drivers, control logic, connectivity, and board bring-up support that make the electronics perform as intended in the final device.
Enclosures, internal layout, connector access, cable routing, cooling paths, sensor placement, and assembly constraints that shape how the electronics fit and operate.
Thermal, airflow, vibration, stress, signal, and power-related analysis to identify risks before the first batch.
Assembled electronics batch (50–100 units / month), CE/FCC review, enclosure samples, packaging, logistics.
We take the product from first validated electronic architecture to an integrated PCBA that can be tested, debugged, and prepared for pilot production.
